3DXSTAT™ ESD PC is an advanced ESD-Safe compound designed for use in critical applications that require electrostatic discharge (ESD) protection. Made using cutting-edge multi-wall carbon nanotube technology, state of the art compounding technology, and precision extrusion processes. Target surface resistance: 10^7 to 10^9 Ohm.
Benefits of Polycarbonate include:
High Thermal Properties: 147°C Tg
Amorphous: Low and near isotropic shrinkage
Excellent ductility / impact resistance
Very low odor emitted during printing
Wide processing range: 265 - 300°C (Max)
Benefits of 3DXSTAT™ include:
Consistent surface resistivity
Improved retention of impact & elongation
Low particulate contamination
Minimal contribution to outgassing and ionic contamination
Industrial: Conveying, Metering, and Sensing applications
Target conductivity for 3DXSTAT™ ESD Polycarbonate:
10^6 to 10^9 ohm surface resistivity on 3DP sample using concentric ring test method.
Note: Internal studies have indicated that increased extruder temperatures can achieve higher levels of conductivity. Likewise, lower extruder temperatures have resulted in lower levels of conductivity. Each printer is set-up differently as well as varied part geometry. Therefore, expect some trial time to understand how this filament works in your specific printer / application.
Recommended Print Conditions:
Extruder: Between 260 and 300°C depending on your printer / extruder. Ideal layer bonding is typically possible at 275 - 280°C.
PC absorbs moisture from the environment, therefore it is important to keep this filament dry between uses. You will see bubbles / hear popping if the PC gets wet. If this happens, dry the filament in a small oven at 150°F for 3-4 hours. Note, the typical drying temperature for PC is 120°C (not F), but the reel that the filament is supplied on will fail at 120°C. Therefore, do not dry the filament at this temperature unless you remove the length you want to print with from the reel.